"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.
Low-temperature bonding from 80℃ unlocks the potential of heat-sensitive devices.
We have achieved high-precision mounting on thermally fragile chips and film substrates, which was impossible with conventional solder mounting. Standard solder joints require high temperatures of 260°C, but MONSTER PAC enables low-temperature bonding at 80°C to 170°C using conductive paste. This suppresses thermal expansion of materials and allows for narrow pitches of less than 40μm and high-precision mounting of less than 3μm. It is a suitable method for mounting advanced devices sensitive to heat, such as magnetic sensors and MEMS. *You can download the technical details and specifications of MONSTER PAC from here.*
- Company：コネクテックジャパン
- Price：Other
